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Active Thermal Control of IGBT Modules Based on Finite-Time Boundedness

One of the most important causes of the failure of power electronic modules is thermal stress. Proper thermal management plays an important role in more reliable and cost-effective energy conversion. In this paper, we present an advanced active thermal control (ATC) strategy to reduce a power device...

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Principais autores: Zhen Hu, Xiaohua Wu, Man Cui
פורמט: Artigo
שפה:Inglês
יצא לאור: MDPI AG 2023-11-01
סדרה:Micromachines
נושאים:
IGBTs
thermal management
reliability
junction temperature
גישה מקוונת:https://www.mdpi.com/2072-666X/14/11/2075
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