Active Thermal Control of IGBT Modules Based on Finite-Time Boundedness
One of the most important causes of the failure of power electronic modules is thermal stress. Proper thermal management plays an important role in more reliable and cost-effective energy conversion. In this paper, we present an advanced active thermal control (ATC) strategy to reduce a power device...
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| Hlavní autoři: | , , |
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| Médium: | Artigo |
| Jazyk: | Inglês |
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MDPI AG
2023-11-01
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| Edice: | Micromachines |
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| On-line přístup: | https://www.mdpi.com/2072-666X/14/11/2075 |
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