A high-performance nano-copper paste with good oxidation resistance
Copper nanoparticles (Cu NPs) are promising candidates for next-generation interconnect materials in power electronics due to their excellent electrical and thermal conductivity and low cost. However, their susceptibility to surface oxidation hinders sintering and device integration. In this work, C...
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| Asıl Yazarlar: | , , , , |
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| Materyal Türü: | Artigo |
| Dil: | Inglês |
| Baskı/Yayın Bilgisi: |
Elsevier
2025-09-01
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| Seri Bilgileri: | Journal of Materials Research and Technology |
| Konular: | |
| Online Erişim: | http://www.sciencedirect.com/science/article/pii/S2238785425019635 |
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