Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics
Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising candidate for metal-based inks/pastes. Cu has high intrinsic electrical/thermal conductivity, which is more cost-effecti...
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| Hlavní autoři: | , |
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| Médium: | Artigo |
| Jazyk: | Inglês |
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MDPI AG
2020-08-01
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| Edice: | Nanomaterials |
| Témata: | |
| On-line přístup: | https://www.mdpi.com/2079-4991/10/9/1689 |
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