Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics
Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising candidate for metal-based inks/pastes. Cu has high intrinsic electrical/thermal conductivity, which is more cost-effecti...
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| Główni autorzy: | , |
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| Format: | Artigo |
| Język: | Inglês |
| Wydane: |
MDPI AG
2020-08-01
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| Seria: | Nanomaterials |
| Hasła przedmiotowe: | |
| Dostęp online: | https://www.mdpi.com/2079-4991/10/9/1689 |
| Etykiety: |
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