A Non-destructive Evaluation of Microstructural Analysis in Sn-Ag-Cu Solder Joint by Synchrotron X-Ray Radiation Tomography

This paper demonstrates a non-destructive technique to evaluate the internal microstructure in the Sn-Ag-Cu (SAC) solder joint through synchrotron X-ray radiation tomography. Synchrotron X-ray tomography is increasingly utilized for characterizing the internal microstructure of materials in 3D image...

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Auteurs principaux:	C.Y. Tan, M.A.A. Mohd Salleh, N. Saud, M. Nabialek, A. Rylski
Format:	Artigo
Langue:	Inglês
Publié:	Polish Academy of Sciences 2024-06-01
Collection:	Archives of Metallurgy and Materials
Sujets:	synchrotron tomography spring-8 solder joint 3d microstructure
Accès en ligne:	https://journals.pan.pl/Content/131907/AMM-2024-2-43-Tan.pdf
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