Microstructure and Properties of Bi-Sn, Bi-Sn-Sb, and Bi-Sn-Ag Solder Alloys for Electronic Applications

The Bi-Sn, Bi-Sn-Ag, and Bi-Sn-Sb solder alloy systems represent lead-free, environmentally friendly alternatives for reliable electronic assembly. These alloys comply with increasingly strict environmental and health regulations, while offering low melting points suitable for soldering temperature-...

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Detalles Bibliográficos

Principais autores:	Andrei-Alexandru Ilie, Florentina Niculescu, Gheorghe Iacob, Ion Pencea, Florin Miculescu, Robert Bololoi, Dumitru-Valentin Drăguț, Alexandru-Cristian Matei, Mihai Ghiţă, Adrian Priceputu, Constantin Ungureanu
Formato:	Artigo
Idioma:	Inglês
Publicado:	MDPI AG 2025-08-01
Series:	Metals
Assuntos:	Bi-Sn based alloys Ag and Sb additions optical microscopy SEM-EDS BSED low-temperature soldering
Acceso en liña:	https://www.mdpi.com/2075-4701/15/8/915
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