Código QR

Interface Growth and Void Formation in Sn/Cu and Sn0.7Cu/Cu Systems

In this work, the effects of electroplated Cu (EP Cu) and Cu addition (0.7%) in Sn solder on the intermetallic compounds (IMCs) growth and void formation were clarified by comparison with solder joints comprising of high purity Cu (HP Cu) substrate and pure Sn solder. After aging processes, a new IM...

Descrición completa

Gardado en:
Principais autores: Jieshi Chen, Yongzhi Zhang, Zhishui Yu, Peilei Zhang, Wanqin Zhao, Jin Yang, Di Wu
Formato: Artigo
Idioma:Inglês
Publicado: MDPI AG 2018-12-01
Series:Applied Sciences
Assuntos:
Sn/Cu solder joint
intermetallic compounds
void
electroplated Cu
Cu addition
Acceso en liña:https://www.mdpi.com/2076-3417/8/12/2703
Tags: Engadir etiqueta
Sen Etiquetas, Sexa o primeiro en etiquetar este rexistro!

Títulos similares