In Situ Study on Cu-to-Cu Thermal Compression Bonding
Cu-to-Cu thermal compression bonding (TCB) has emerged as a promising solution for ultrafine pitch packaging in 3D integrated circuit technologies. Despite the progress made by conventional Cu-to-Cu TCB methods in achieving good mechanical strength of the Cu bonds, the bonding processes generally re...
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| Autors principals: | , , , , , , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
MDPI AG
2023-06-01
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| Col·lecció: | Crystals |
| Matèries: | |
| Accés en línia: | https://www.mdpi.com/2073-4352/13/7/989 |
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