In-situ AFM observation of enhanced thermal expansion in downscaled nanotwinned-Cu/SiO2 vias for 3D IC integration

Three-dimensional integrated circuit (3D IC) packaging offers viable solutions to sustain Moore's Law. Hybrid bonding, a key process in 3D IC packaging, enables high-density interconnections between stacked chips but faces fabrication challenges as the pitch continues to scale down. This study explo...

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Autors principals:	Huai-En Lin, Wei-Lan Chiu, Hsiang-Hung Chang, Chih Chen
Format:	Artigo
Idioma:	Inglês
Publicat:	Elsevier 2025-05-01
Col·lecció:	Journal of Materials Research and Technology
Matèries:	3D IC packaging Hybrid bonding In-situ AFM Nanotwinned Cu Thermal expansion
Accés en línia:	http://www.sciencedirect.com/science/article/pii/S2238785425013353
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