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In-situ AFM observation of enhanced thermal expansion in downscaled nanotwinned-Cu/SiO2 vias for 3D IC integration

Three-dimensional integrated circuit (3D IC) packaging offers viable solutions to sustain Moore's Law. Hybrid bonding, a key process in 3D IC packaging, enables high-density interconnections between stacked chips but faces fabrication challenges as the pitch continues to scale down. This study explo...

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Principais autores: Huai-En Lin, Wei-Lan Chiu, Hsiang-Hung Chang, Chih Chen
Format: Artigo
Sprog:Inglês
Udgivet: Elsevier 2025-05-01
Serier:Journal of Materials Research and Technology
Fag:
3D IC packaging
Hybrid bonding
In-situ AFM
Nanotwinned Cu
Thermal expansion
Online adgang:http://www.sciencedirect.com/science/article/pii/S2238785425013353
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