Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching

This work aims to provide deep morphological observation on the incorporated TiO _2 nanoparticles within the SAC305 by selective electrochemical etching. Cyclic voltammetry and chronoamperometry were used to investigate the selective etching performances. The removal of β -Sn matrix was conducted at...

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Detalhes bibliográficos

Principais autores:	Muhamad Zamri Yahaya, Muhammad Firdaus Mohd Nazeri, Soorathep Kheawhom, Balázs Illés, Agata Skwarek, Ahmad Azmin Mohamad
Formato:	Artigo
Idioma:	Inglês
Publicado em:	IOP Publishing 2020-01-01
coleção:	Materials Research Express
Assuntos:	intermetallic compounds microstructure SAC reflow soldering TiO2 nanoparticles
Acesso em linha:	https://doi.org/10.1088/2053-1591/ab6b57
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