Post-Release Metallization in MEMS Silicon-to-Silicon Contact Switches for On-Resistance Improvement
This work reports a post-release sputter-metallization process for microelectromechanical systems (MEMS) switches with silicon-to-silicon (Si-to-Si) contacts fabricated by deep reactive ion etching. Platinum (Pt) was selectively deposited on the contacting platforms through a perforated mask. Altern...
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| Asıl Yazarlar: | , , , |
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| Materyal Türü: | Artigo |
| Dil: | Inglês |
| Baskı/Yayın Bilgisi: |
MDPI AG
2026-02-01
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| Seri Bilgileri: | Micromachines |
| Konular: | |
| Online Erişim: | https://www.mdpi.com/2072-666X/17/3/288 |
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