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A MEMS Micro-g Capacitive Accelerometer Based on Through-Silicon-Wafer-Etching Process

This paper presents a micromachined micro-g capacitive accelerometer with a silicon-based spring-mass sensing element. The displacement changes of the proof mass are sensed by an area-variation-based capacitive displacement transducer that is formed by the matching electrodes on both the movable pro...

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Príomhchruthaitheoirí: Kang Rao, Xiaoli Wei, Shaolin Zhang, Mengqi Zhang, Chenyuan Hu, Huafeng Liu, Liang-Cheng Tu
Formáid: Artigo
Teanga:Inglês
Foilsithe / Cruthaithe: MDPI AG 2019-06-01
Sraith:Micromachines
Ábhair:
Rochtain ar líne:https://www.mdpi.com/2072-666X/10/6/380
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