An Effective Hybrid Rescheduling Method for Wafer Chip Precision Packaging Workshops in Complex Manufacturing Environments

With the continuous development of semiconductor manufacturing technology and information technology, the sizes of wafer chips are becoming smaller and the variety is increasing, which has put forward high requirements for wafer chip precision manufacturing and packaging workshops. On the one hand,...

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Bibliografische gegevens

Hoofdauteurs:	Ziyue Wang, Weikang Fang, Yichen Yang
Formaat:	Artigo
Taal:	Inglês
Gepubliceerd in:	MDPI AG 2025-12-01
Reeks:	Micromachines
Onderwerpen:	wafer chip precision manufacturing and packaging rescheduling lot streaming dynamic events
Online toegang:	https://www.mdpi.com/2072-666X/16/12/1403
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