Research on Defect Inspection Technology for Bump Height in Wafer-Level Packaging Based on the Triangulation Method

With the advent of the era of big data and the vigorous development of consumer electronics, the demand for higher-speed processing capacity for gigantic amounts of data is increasing; this requires finer and far more numerous connections between dies as an essential component for connection and ele...

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Detalhes bibliográficos

Principais autores:	Fanchang Meng, Zili Zhang, Yanhui Kang, Chengjun Cui, Dezhao Wang, Xinxin Zhang, Weihu Zhou
Formato:	Artigo
Idioma:	Inglês
Publicado em:	MDPI AG 2023-02-01
coleção:	Applied Sciences
Assuntos:	triangular measurement wafer inspection bump height
Acesso em linha:	https://www.mdpi.com/2076-3417/13/3/1997
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