Phase Measuring Deflectometry for Wafer Thin-Film Stress Mapping
Wafer-level thin-film stress measurement is essential for reliable semiconductor fabrication. However, existing techniques present limitations in practice. Interferometry achieves high precision but at a cost that becomes prohibitive for large wafers. Meanwhile laser-scanning systems are more afford...
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| Hauptverfasser: | , , , , , |
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| Format: | Artigo |
| Sprache: | Inglês |
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MDPI AG
2025-12-01
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| Schriftenreihe: | Sensors |
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| Online-Zugang: | https://www.mdpi.com/1424-8220/25/24/7668 |
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