Effect of voltage on electrochemical mechanical polishing (ECMP) of 4H–SiC with fixed abrasives

This study employs the fixed agglomerated diamond abrasive pad (FADAP) to enhance the processing efficiency and surface quality of 4H–SiC. The effects of voltage on real-time current density, interface resistance, material removal rate (MRR), and surface roughness Ra during the electrochemical mecha...

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Principais autores:	Pengfei Wu, Dongdong Zhao, Ning Liu, Chao Tang, Jun Li, Yongwei Zhu
פורמט:	Artigo
שפה:	Inglês
יצא לאור:	Elsevier 2025-05-01
סדרה:	Journal of Materials Research and Technology
נושאים:	4H–SiC Fixed agglomerated diamond abrasive pad Electrochemical mechanical polishing Voltage Material removal rate
גישה מקוונת:	http://www.sciencedirect.com/science/article/pii/S2238785425011809
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