Hydrophilic thermocompression bonding of single-crystalline 3C-SiC thin film on sapphire substrate
Microelectronic devices for harsh environment applications require new wafer bonding methods that can overcome the large thermal mismatch between functional layer and supporting substrate during bonding process. This paper presents a bonding strategy that leverages the thermocompression bond formati...
-д хадгалсан:
| Үндсэн зохиолчид: | , , , , , |
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| Формат: | Artigo |
| Хэл сонгох: | Inglês |
| Хэвлэсэн: |
Elsevier
2025-07-01
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| Цуврал: | Next Materials |
| Нөхцлүүд: | |
| Онлайн хандалт: | http://www.sciencedirect.com/science/article/pii/S2949822825002631 |
| Шошгууд: |
Шошго байхгүй, Энэхүү баримтыг шошголох эхний хүн болох!
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