Hydrophilic thermocompression bonding of single-crystalline 3C-SiC thin film on sapphire substrate
Microelectronic devices for harsh environment applications require new wafer bonding methods that can overcome the large thermal mismatch between functional layer and supporting substrate during bonding process. This paper presents a bonding strategy that leverages the thermocompression bond formati...
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| Autors principals: | , , , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
Elsevier
2025-07-01
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| Col·lecció: | Next Materials |
| Matèries: | |
| Accés en línia: | http://www.sciencedirect.com/science/article/pii/S2949822825002631 |
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