Design of intelligent inspection system for solder paste printing defects based on improved YOLOX
Summary: Aiming at the current SPI (solder paste inspection) system for printing solder paste similar defects detection accuracy is not high, the system intelligence degree is low and so on, design a for the solder paste similar defects and combined with phase modulation profile measurement techniqu...
I tiakina i:
| Ngā kaituhi matua: | , , , , |
|---|---|
| Hōputu: | Artigo |
| Reo: | Inglês |
| I whakaputaina: |
Elsevier
2024-03-01
|
| Rangatū: | iScience |
| Ngā marau: | |
| Urunga tuihono: | http://www.sciencedirect.com/science/article/pii/S2589004224003687 |
| Ngā Tūtohu: |
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
|