ATNet: A Defect Detection Framework for X-ray Images of DIP Chip Lead Bonding
In order to improve the production quality and qualification rate of chips, X-ray nondestructive imaging technology has been widely used in the detection of chip defects, which represents an important part of the quality inspection of products after packaging. However, the current traditional defect...
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| Hlavní autoři: | , , , , , , , |
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| Médium: | Artigo |
| Jazyk: | Inglês |
| Vydáno: |
MDPI AG
2023-07-01
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| Edice: | Micromachines |
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| On-line přístup: | https://www.mdpi.com/2072-666X/14/7/1375 |
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