Design of intelligent inspection system for solder paste printing defects based on improved YOLOX
Summary: Aiming at the current SPI (solder paste inspection) system for printing solder paste similar defects detection accuracy is not high, the system intelligence degree is low and so on, design a for the solder paste similar defects and combined with phase modulation profile measurement techniqu...
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| Principais autores: | , , , , |
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| Format: | Artigo |
| Jezik: | Inglês |
| Izdano: |
Elsevier
2024-03-01
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| Serija: | iScience |
| Teme: | |
| Online dostop: | http://www.sciencedirect.com/science/article/pii/S2589004224003687 |
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