Preparation of Ag2O modified silica abrasives and their chemical mechanical polishing performances on sapphire

Abstract The chemical mechanical polishing (CMP) process has become a widely accepted global planarization technology. The abrasive material is one of the key elements in CMP. In the presented paper, an Ag-doped colloidal SiO2 abrasive is synthesized by a seed-induced growth method. It is characteri...

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Hlavní autoři:	Baichun Zhang, Hong Lei, Yi Chen
Médium:	Artigo
Jazyk:	Inglês
Vydáno:	Tsinghua University Press 2017-06-01
Edice:	Friction
Témata:	chemical mechanical polishing Ag-doped colloidal silica abrasive sapphire material removal rate
On-line přístup:	http://link.springer.com/article/10.1007/s40544-017-0156-8
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