A Method for Fast Au-Sn Bonding at Low Temperature Using Thermal Gradient

Flip chip bonding technology on gold–tin (Au-Sn) microbumps for MEMS (Micro Electro Mechanical Systems) and 3D packaging is becoming increasingly important in the electronics industry. The main advantages of Au-Sn microbumps are a low electrical resistance, high electrical reliability, and fine pitc...

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Principais autores:	Wenchao Wang, Ziyu Liu, Delong Qiu, Zhiyuan Zhu, Na Yan, Shijin Ding, David Wei Zhang
Format:	Artigo
Jezik:	Inglês
Izdano:	MDPI AG 2023-12-01
Serija:	Micromachines
Teme:	flip chip Au-Sn solid-state diffusion (SSD) thermal gradient bonding (TGB) intermetallic compound (IMC)
Online dostop:	https://www.mdpi.com/2072-666X/14/12/2242
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