Interface-driven anomalies in irradiation damage: Multiscale simulation of asymmetric diffusion and mechanical degradation in SnPb solder joints under electron irradiation

Understanding the interfacial atomic mechanisms and degradation pathways in solder joints under irradiation is critical for the long-term reliability of electronic packaging in harsh environments. This study elucidates the atomic-scale mechanisms governing microstructural evolution and mechanical pr...

Бүрэн тодорхойлолт

Номзүйн дэлгэрэнгүй

Үндсэн зохиолчид:	Qilong Guan, Kai Li, Shengli Li, Xiaojiu Tang, Ruiqi Wang, Xuan Li, Guanhui Cui, Shuo Kong, Chunjin Hang
Формат:	Artigo
Хэл сонгох:	Inglês
Хэвлэсэн:	Elsevier 2025-09-01
Цуврал:	Materials & Design
Нөхцлүүд:	Electron irradiation SnPb eutectic solder joints Interfacial atomic mechanisms DFT calculations Mechanical property degradation
Онлайн хандалт:	http://www.sciencedirect.com/science/article/pii/S0264127525008755
Шошгууд:	Шошго нэмэх Шошго байхгүй, Энэхүү баримтыг шошголох эхний хүн болох!