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Effect of gamma irradiation on microstructural evolution and mechanical properties of Sn3Ag0.5Cu solder joints

Sn3Ag0.5Cu (SAC305) Ball Grid Array (BGA) solder joints were exposed to 60Co source gamma irradiation at a dose rate of 1 Gy(Si)/s from 0 to 200 h in air. The effects of gamma irradiation on the microstructure evolution and mechanical properties of the solder joints were investigated. β-Sn interacte...

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Bibliografiske detaljer
Principais autores: Qilong Guan, Chunjin Hang, Gang Yao, Shengli Li, Dan Yu, Ying Ding, Yanhong Tian
Format: Artigo
Sprog:Inglês
Udgivet: Elsevier 2023-05-01
Serier:Journal of Materials Research and Technology
Fag:
Online adgang:http://www.sciencedirect.com/science/article/pii/S2238785423008426
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