Study on Thermal Conductivity and Mechanical Properties of Cyclotriphosphazene Resin-Forced Epoxy Resin Composites

Cyclotriphosphazenes, a variety of inorganic rings together with a curing ingredient, 4,4′-methylene dianiline (MDA), are mainly used to enhance the thermal conductivity and mechanical characteristics of epoxy resin (DGEBA). Three DGEBA@MDA, HGCP@MDA, and thermosets were produced, and their curing b...

Descrizione completa

Dettagli Bibliografici

Autori principali:	Omar Dagdag, Lahoucine El Gana, Rajesh Haldhar, Avni Berisha, Seong-Cheol Kim, Elyor Berdimurodov, Othman Hamed, Shehdeh Jodeh, Ekemini Daniel Akpan, Eno Effiong Ebenso
Natura:	Artigo
Lingua:	Inglês
Pubblicazione:	MDPI AG 2023-03-01
Serie:	Crystals
Soggetti:	Cyclotriphosphazenes epoxy resin DGEBA HGCP thermal conductivity mechanical properties
Accesso online:	https://www.mdpi.com/2073-4352/13/3/478
Tags:	Aggiungi Tag Nessun Tag, puoi essere il primo ad aggiungerne!!