QR Code

Study on Thermal Conductivity and Mechanical Properties of Cyclotriphosphazene Resin-Forced Epoxy Resin Composites

Cyclotriphosphazenes, a variety of inorganic rings together with a curing ingredient, 4,4′-methylene dianiline (MDA), are mainly used to enhance the thermal conductivity and mechanical characteristics of epoxy resin (DGEBA). Three DGEBA@MDA, HGCP@MDA, and thermosets were produced, and their curing b...

Whakaahuatanga katoa

I tiakina i:
Ngā kaituhi matua: Omar Dagdag, Lahoucine El Gana, Rajesh Haldhar, Avni Berisha, Seong-Cheol Kim, Elyor Berdimurodov, Othman Hamed, Shehdeh Jodeh, Ekemini Daniel Akpan, Eno Effiong Ebenso
Hōputu: Artigo
Reo:Inglês
I whakaputaina: MDPI AG 2023-03-01
Rangatū:Crystals
Ngā marau:
Cyclotriphosphazenes
epoxy resin
DGEBA
HGCP
thermal conductivity
mechanical properties
Urunga tuihono:https://www.mdpi.com/2073-4352/13/3/478
Ngā Tūtohu: Tāpirihia he Tūtohu
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!

Ngā tūemi rite