Study on Thermal Conductivity and Mechanical Properties of Cyclotriphosphazene Resin-Forced Epoxy Resin Composites
Cyclotriphosphazenes, a variety of inorganic rings together with a curing ingredient, 4,4′-methylene dianiline (MDA), are mainly used to enhance the thermal conductivity and mechanical characteristics of epoxy resin (DGEBA). Three DGEBA@MDA, HGCP@MDA, and thermosets were produced, and their curing b...
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| 主要な著者: | , , , , , , , , , |
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| フォーマット: | Artigo |
| 言語: | Inglês |
| 出版事項: |
MDPI AG
2023-03-01
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| シリーズ: | Crystals |
| 主題: | |
| オンライン･アクセス: | https://www.mdpi.com/2073-4352/13/3/478 |
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