Multi grade polishing pad for sapphire chemical mechanical polishing
The synergy between polishing pad and abrasive is the key to material removal in chemical mechanical polishing (CMP). In order to achieve uniform material removal, a new multi gradient polishing pad for sapphire CMP was developed. Based on the boundary conditions and three basic contact equations be...
Kaydedildi:
| Asıl Yazarlar: | , , , , , |
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| Materyal Türü: | Artigo |
| Dil: | Inglês |
| Baskı/Yayın Bilgisi: |
Elsevier
2026-03-01
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| Seri Bilgileri: | Journal of Materials Research and Technology |
| Konular: | |
| Online Erişim: | http://www.sciencedirect.com/science/article/pii/S2238785426001663 |
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