Wafer-Level Self-Packaging Design and Fabrication of MEMS Capacitive Pressure Sensors

This paper reports a MEMS capacitive pressure sensor (CPS) based on the operating principle of touch mode. The CPS was designed and fabricated using wafer-level self-packaged MEMS processes. The variable capacitance sensing structure was vacuum-sealed in a cavity using the Si–glass anodic bonding te...

Бүрэн тодорхойлолт

Номзүйн дэлгэрэнгүй

Үндсэн зохиолчид:	Yuanjie Wan, Zhiwei Li, Zile Huang, Baofa Hu, Wenlong Lv, Chunquan Zhang, Haisheng San, Shaoda Zhang
Формат:	Artigo
Хэл сонгох:	Inglês
Хэвлэсэн:	MDPI AG 2022-05-01
Цуврал:	Micromachines
Нөхцлүүд:	capacitive pressure sensors MEMS self-packaging Si–glass bonding
Онлайн хандалт:	https://www.mdpi.com/2072-666X/13/5/738
Шошгууд:	Шошго нэмэх Шошго байхгүй, Энэхүү баримтыг шошголох эхний хүн болох!