TripletMatch: Wafer Map Defect Detection Using Semi-Supervised Learning and Triplet Loss With Mixup
In the semiconductor manufacturing process, Electrical Die Sorting (EDS) is a post-production process used to assess the quality of each chip on the wafer. The results from EDS testing are visualized as a wafer bin map (WBM), which is used for quality control purposes, such as the identification of...
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| Principais autores: | , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
IEEE
2024-01-01
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| coleção: | IEEE Access |
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| Acesso em linha: | https://ieeexplore.ieee.org/document/10776974/ |
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