Semi-Supervised Learning Under Extreme Class Imbalance in Wafer Bin Map Defect Pattern Classification

The semiconductor industry faces significant challenges in wafer quality assessment due to the increasing complexity of device fabrication and the rise in inline defects and circuit failures. As manufacturing processes advance, conventional manual analysis of wafer bin maps (WBMs) has become impract...

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Hlavní autoři:	Jinyong Jeong, Hyungu Kahng, Seoung Bum Kim
Médium:	Artigo
Jazyk:	Inglês
Vydáno:	IEEE 2026-01-01
Edice:	IEEE Access
Témata:	Wafer bin map defect pattern classification semiconductor manufacturing semi-supervised learning class-imbalanced learning class-imbalanced semi-supervised learning
On-line přístup:	https://ieeexplore.ieee.org/document/11368897/
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