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Study of MOSFET transistors in various hermetic surface-mount packages

The assembly processes of MOSFET transistors in the SMD-1 metal-ceramic package were investigated in comparison with the SMD-220 metal-plastic package. Results regarding electrical and thermal parameters are presented. It is shown that the “p-n junction–package” thermal resistance is higher for SMD-...

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Guardat en:
Autors principals: I. I. Rubtsevitch, L. P. Anufriev, A. F. Kerentsev
Format: Artigo
Idioma:Inglês
Publicat: Politekhperiodika 2004-10-01
Col·lecció:Технологія та конструювання в електронній апаратурі
Matèries:
mosfet transistor
metal-ceramic package
surface mounting
package hermeticity
transistor thermal resistance
Accés en línia:https://tkea.com.ua/index.php/journal/article/view/1128
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