Study of MOSFET transistors in various hermetic surface-mount packages
The assembly processes of MOSFET transistors in the SMD-1 metal-ceramic package were investigated in comparison with the SMD-220 metal-plastic package. Results regarding electrical and thermal parameters are presented. It is shown that the “p-n junction–package” thermal resistance is higher for SMD-...
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| Auteurs principaux: | , , |
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| Format: | Artigo |
| Langue: | Inglês |
| Publié: |
Politekhperiodika
2004-10-01
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| Collection: | Технологія та конструювання в електронній апаратурі |
| Sujets: | |
| Accès en ligne: | https://tkea.com.ua/index.php/journal/article/view/1128 |
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