Low-Temperature Diffusion of Au and Ag Nanolayers for Cu Bonding
With the recent rapid development of IT technology, the demand for multifunctional semiconductor devices capable of high performance has increased rapidly, and the miniaturization of such devices has also faced limitations. To overcome these limitations, various studies have investigated three-dimen...
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| Autori principali: | , , |
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| Natura: | Artigo |
| Lingua: | Inglês |
| Pubblicazione: |
MDPI AG
2023-12-01
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| Serie: | Applied Sciences |
| Soggetti: | |
| Accesso online: | https://www.mdpi.com/2076-3417/14/1/147 |
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