First Demonstration of Enhanced Cu-Cu Bonding at Low Temperature With Ruthenium Passivation Layer

In this work, we studied the characteristics of Cu-Cu bonding with a ruthenium passivation layer at low temperatures. It is confirmed that the ruthenium passivation layer is effective in preventing the formation of native copper oxide, and diffusion of the copper into the ruthenium passivation layer...

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Bibliografski detalji

Glavni autori:	Sang Woo Park, Seul Ki Hong, Sarah Eunkyung Kim, Jong Kyung Park
Format:	Artigo
Jezik:	Inglês
Izdano:	IEEE 2024-01-01
Serija:	IEEE Access
Teme:	3D integration Cu-Cu bonding metal passivation ruthenium
Online pristup:	https://ieeexplore.ieee.org/document/10547212/
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