First Demonstration of Enhanced Cu-Cu Bonding at Low Temperature With Ruthenium Passivation Layer
In this work, we studied the characteristics of Cu-Cu bonding with a ruthenium passivation layer at low temperatures. It is confirmed that the ruthenium passivation layer is effective in preventing the formation of native copper oxide, and diffusion of the copper into the ruthenium passivation layer...
Bewaard in:
| Hoofdauteurs: | , , , |
|---|---|
| Formaat: | Artigo |
| Taal: | Inglês |
| Gepubliceerd in: |
IEEE
2024-01-01
|
| Reeks: | IEEE Access |
| Onderwerpen: | |
| Online toegang: | https://ieeexplore.ieee.org/document/10547212/ |
| Tags: |
Geen labels, Wees de eerste die dit record labelt!
|