A machine learning approach for evaluating drop impact reliability of solder joints in BGA packaging
The failure of solder joints of Ball Grid Array (BGA)Package under drop impact is influenced by multiple parameters, highlighting the need for optimization during the early design stages of electronic systems. In this paper, ensemble methods were developed to predict failure in solder joints by esti...
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| Автори: | , |
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| Формат: | Artigo |
| Мова: | Inglês |
| Опубліковано: |
Polish Association for Knowledge Promotion
2025-09-01
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| Серія: | Applied Computer Science |
| Предмети: | |
| Онлайн доступ: | https://ph.pollub.pl/index.php/acs/article/view/7340 |
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