Finite element simulation of reliability of BGA solder joints under mechanical loading and temperature cycling conditions
To address the issues of low reliability of ball grid array (BGA) solder joints under combined effect of mechanical loading from heat sinks and thermal cycling loads, with unclear influencing factors from heat sink mechanical loading, a finite element simulation was conducted to analyze the stress a...
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| Principais autores: | , , , , |
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| פורמט: | Artigo |
| שפה: | Chinês |
| יצא לאור: |
Editorial Office of Transactions of the China Welding Institution, Welding Journals Publishing House
2025-10-01
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| סדרה: | Hanjie xuebao |
| נושאים: | |
| גישה מקוונת: | https://doi.org/10.12073/j.hjxb.20240730001 |
| תגים: |
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