Finite element simulation of reliability of BGA solder joints under mechanical loading and temperature cycling conditions

To address the issues of low reliability of ball grid array (BGA) solder joints under combined effect of mechanical loading from heat sinks and thermal cycling loads, with unclear influencing factors from heat sink mechanical loading, a finite element simulation was conducted to analyze the stress a...

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Главные авторы:	Wenlong LENG, Xubing CHEN, Cong ZHANG, Jie FANG, Dong YE
Формат:	Artigo
Язык:	Chinês
Опубликовано:	Editorial Office of Transactions of the China Welding Institution, Welding Journals Publishing House 2025-10-01
Серии:	Hanjie xuebao
Предметы:	ball grid array finite element simulation solder joint reliability mechanical loading temperature cycling
Online-ссылка:	https://doi.org/10.12073/j.hjxb.20240730001
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