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Improved DC and RF Characteristics of GaN HEMT Using a Back-Barrier and Locally Doped Barrier Layer

To enhance the DC and RF performance of AlGaN/GaN HEMTs, a novel device structure was proposed and investigated through simulation. The key innovation of this new structure lies in the incorporation of an Al<sub>0.7</sub>In<sub>0.15</sub>Ga<sub>0.15</sub>N back-barrier layer and an N-type locally do...

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Auteurs principaux: Shuxiang Sun, Lulu Liu, Gangchuan Qu, Xintong Xie, J. Ajayan
Format: Artigo
Langue:Inglês
Publié: MDPI AG 2025-06-01
Collection:Micromachines
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Accès en ligne:https://www.mdpi.com/2072-666X/16/7/779
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