Influence of deposition conditions on ALD based Ru passivation for Cu-Cu hybrid bonding

Abstract Cu-Cu hybrid bonding is a key technology for fine-pitch interconnections in advanced semiconductor packaging. However, native Cu oxidation and interface instability hinder reliable low-temperature bonding. While noble metal passivation can mitigate oxidation, conventional sputtering-based m...

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Autori principali:	Sang Woo Park, Hee Han, Chi Won Ahn, Jong Kyung Park
Natura:	Artigo
Lingua:	Inglês
Pubblicazione:	Nature Portfolio 2025-10-01
Serie:	Scientific Reports
Soggetti:	Ru passivation Cu-Cu bonding PEALD Hybrid bonding.
Accesso online:	https://doi.org/10.1038/s41598-025-20296-z
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