Influence of deposition conditions on ALD based Ru passivation for Cu-Cu hybrid bonding

Abstract Cu-Cu hybrid bonding is a key technology for fine-pitch interconnections in advanced semiconductor packaging. However, native Cu oxidation and interface instability hinder reliable low-temperature bonding. While noble metal passivation can mitigate oxidation, conventional sputtering-based m...

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Autores principales:	Sang Woo Park, Hee Han, Chi Won Ahn, Jong Kyung Park
Formato:	Artigo
Lenguaje:	Inglês
Publicado:	Nature Portfolio 2025-10-01
Colección:	Scientific Reports
Materias:	Ru passivation Cu-Cu bonding PEALD Hybrid bonding.
Acceso en línea:	https://doi.org/10.1038/s41598-025-20296-z
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