CoSn<sub>3</sub> Intermetallic Nanoparticles for Electronic Packaging
At present, composite solder pastes are getting a lot of attention, especially composite Sn based solders reinforced by nanoparticles. Indeed, CoSn<sub>3</sub> is a strong nucleating agent of Sn crystal, which has potential application value in the field of electronic packaging. However, there is no...
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| Principais autores: | , , , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado: |
MDPI AG
2022-11-01
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| Series: | Nanomaterials |
| Assuntos: | |
| Acceso en liña: | https://www.mdpi.com/2079-4991/12/22/4083 |
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