A Sn3Ag–CoSn3 composite copper pillar bump for three-dimensional packaging
Copper pillar bumps are widely utilized in advanced packaging technologies, representing a crucial foundation for 3D packaging. However, the mechanical properties of Sn3Ag bumps on copper columns often fall short of meeting increasingly demanding service conditions. Additionally, the loss of effecti...
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| Autores principales: | , , , , , , , , , , |
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| Formato: | Artigo |
| Lenguaje: | Inglês |
| Publicado: |
Elsevier
2024-11-01
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| Colección: | Journal of Materials Research and Technology |
| Materias: | |
| Acceso en línea: | http://www.sciencedirect.com/science/article/pii/S2238785424025912 |
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