An innovative high-entropy alloy solder for high-reliability low-temperature bonding in 3D electronic packaging–based on nano InSnBiZnAg particles
To address the demand for multilevel package, a low-melting-point high entropy alloy (HEA) solder was developed. It consists of 43In28Sn14Bi9Zn6Ag micro- and nano-particles with a melting point of about 62.80 °C. We obtained 43In28Sn14Bi9Zn6Ag nanoparticles by combining ultrasonic heating interactio...
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| Autors principals: | , , , , , , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
Elsevier
2024-05-01
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| Col·lecció: | Journal of Materials Research and Technology |
| Accés en línia: | http://www.sciencedirect.com/science/article/pii/S2238785424010317 |
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