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In Situ Study the Grooving Effect Induced by Ag Particles on Rapid Growth of Cu<sub>6</sub>Sn<sub>5</sub> Grain at Sn-xAg/Cu Soldering Interface during the Heat Preservation Stage

Synchrotron radiation X-ray imaging technique was applied for in situ observation of Cu<sub>6</sub>Sn<sub>5</sub> intermetallic compounds (IMC) growth in Sn/Cu and Sn-3.5Ag/Cu joints under isothermal temperature conditions of 250/300/350 °C and time duration of 1.5 h. The IMC in Sn-Ag solder was cha...

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Principais autores: Bingfeng Guo, Haitao Ma, Anil Kunwar, Rongzhi Wang, Han Zheng
פורמט: Artigo
שפה:Inglês
יצא לאור: MDPI AG 2023-08-01
סדרה:Metals
נושאים:
reflow soldering
synchrotron radiation
intermetallic compounds
grooves
growth kinetics
גישה מקוונת:https://www.mdpi.com/2075-4701/13/8/1445
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