Simulation for Cu Atom Diffusion Leading to Fluctuations in Solder Properties and Cu₆Sn₅ Growth during Multiple Reflows

The multiple reflows process is widely used in 3D packaging in the field of electronic packaging. The growth behavior of interfacial intermetallic compound (IMC) is more important to the reliability of solder joints. In this paper, experimental measurement combined with simulation calculation were p...

Ausführliche Beschreibung

Bibliografische Detailangaben

Hauptverfasser:	Min Shang, Chong Dong, Haoran Ma, Yunpeng Wang, Haitao Ma
Format:	Artigo
Sprache:	Inglês
Veröffentlicht:	MDPI AG 2021-12-01
Schriftenreihe:	Metals
Schlagworte:	multiple reflow Cu concentration Cu<sub>6</sub>Sn<sub>5</sub> growth solder property
Online-Zugang:	https://www.mdpi.com/2075-4701/11/12/2041
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